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The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 Datacon/Besi now form a real worldwide leader in the supply of many different packaging-equipment A startling phenomenon in the European back-end industry. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial, radio-frequency identification (RFID), light emitting diode (LED) and solar energy. While parts may be readily available from other industry service companies, research has proven that. We’re able to fulfill your requirements knowledgeably and efficiently. Dong Guan Hong Cheng Import &Export Co.,Ltd Marketplace Listings. It operates through three segments: Die Attach, Packaging and Plating. We understand the importance replacement part decisions and know how they impact your workflow. Proficient in programming Datacon 2200 evo automated bonder for die attach, flip chip, fluxing and conductive adhesive attach. Used SMT Equipment, PCB Equipment & Machines for sale. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries.

(Besi), incorporated in May 1995, is a holding company. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.